CRP ( Sumitomo Bakelite )
Contact Window : Eric
a.Underfill material used in Flip Chip products.
b.Potting material used in globtop packaging.

 CRC ( Sumitomo Bakelite )
Contact Window : Eric
Used in wafer buffer coat and RDL for WLCSP.

 DDF ( Sumitomo Bakelite )
Contact Window : Eric
Used for ultra-thin chips, CSP, and epitactic chips; used mainly as a chip adhesive.

Cover Tape ( SUMI Carrier )
Contact Window : Eric
　

 L/F ( Sumitomo Metal Mining Asia Pacific)
Contact Window : Johnson
The world class vendor. Manufactures all types of meatl leadframes with full range of pin count and matrix design.   

-> Open Tool List 2008

 BCC & QFN ( Sumitomo Metal Mining )
Contact Window : Johnson
Taiwan's largest and most complete vendor. Provides high-precision substrates for use in communications IC products.    

Tape BGA/CSP & TCP/COF ( Sumitomo metal mining package materials )
Contact Window : Brian
Used for tape bonding soft substrate materials.  

Substrate ( Kyocera )
Contact Window : Ivan
Build up substrate for high density and ultra high pin count packages.  Such as ASIC , CPU , Graphics Processors , Networking Processors , etc. that require flip chip assembly.

Substrate ( ASEE )
Contact Window : Ivan
BOC subs was designed as a cost-effective CSP solution specially for high-frequency memory devices, Such as DDR-II , SDRAM , SGRAM , RAMBUS and next-generation memory products.

Bonding Wire ( Sumitomo Metal Mining )
Contact Window : Eric
We have bonding wire in wide range of diameters suitable for high/low loop and ultra fine pitch processes. We supply bonding wire to all major IC packaging and discrete component factories.  

Lead-free Solder Ball  ( HITACHI )
Contact Window : Karl
We supply a full range size of lead-free solder balls. And with our advanced R&D technology and production technology, we are able to provide you high quality and products.

UV Tape  ( Sumitomo Bakelite )
Contact Window : Steve
We supply high stability and workability UV tape pre-cut for IC wafer sawing.

Auto Molding Equipment / G-LINE ( APIC YAMADA )
Contact Window : Thomas
Our fully automated molding equipment is designed with the modular concept. Modules can be increased from two to four to meet customers' capacity needs. The key difference from componetiong products is that we have applied to patent our "FAME" technology in several nations. Now your can use "FAME" to satisfy your products needs.

Trim & Form Equipment / A-COMBO Series  ( APIC YAMADA )
Contact Window : Cyrano 
Targeting our customers' specific needs, this system can be readily linked with other equipment. For instance, it is highly compatible with marketing, testing, tube loading, or tray loading systems. Both single-row TSOPs and multi-row QFPs can be handled by the same machine.
The change over time is about  30 minutes. Capacity and efficiency have been sharply improved. Can be used with 20~80mm width leadframes.

LED mold technology with liquid compound / Compression Mold  ( APIC YAMADA )
Contact Window : Alex
The manual/Auto mold equipment is match the module design rule, the equipment also applies to LED packing territory.

1. Ability for Liquid Compound – Higher Power & Longer Life – Durability for Heat & Light
2. Lower Cost production – Higher Productivity – Lesser Process – Capability for Low Cost Interposer (Lead Frame)
3. Smaller & Thinner Package – Freedom of Package design – Simple package design/construction
　

Package Sawing Equipment / MAPS-300J  ( APIC YAMADA )
Contact Window : Alex
Plastic package dicing process is the one of epoch-making for the semiconductor assembly field. However, the high class wafer dicing system is only available in the market.
MAPS-300 series is developed for the dedicated plastic package singulation , which has in-line lay-out and high speed twin spindle.
This system provides low cost and easy in-line operation.