CRP ( Sumitomo Bakelite )
Contact Window : Jet
a.Underfill material used in Flip Chip products.
b.Potting material used in globtop packaging.

 CRC ( Sumitomo Bakelite )
Contact Window : Jet
Used in wafer buffer coat and RDL for WLCSP.

 DDF ( Sumitomo Bakelite )
Contact Window : Jet
Used for ultra-thin chips, CSP, and epitactic chips; used mainly as a chip adhesive.

Cover Tape ( SUMI Carrier )
Contact Window : Jet
　

 L/F ( Sumitomo Metal Mining Asia Pacific)
Contact Window : Johnson
The world class vendor. Manufactures all types of meatl leadframes with full range of pin count and matrix design.   

-> Open Tool List 2008

 BCC & QFN ( Sumitomo Metal Mining )
Contact Window : Johnson
Taiwan's largest and most complete vendor. Provides high-precision substrates for use in communications IC products.    

Tape BGA/CSP & TCP/COF ( Sumitomo metal mining package materials )
Contact Window : Brian
Used for tape bonding soft substrate materials.  

Substrate ( Kyocera )
Contact Window : Ivan
Build up substrate for high density and ultra high pin count packages.  Such as ASIC , CPU , Graphics Processors , Networking Processors , etc. that require flip chip assembly.

Substrate ( ASEE )
Contact Window : Ivan
BOC subs was designed as a cost-effective CSP solution specially for high-frequency memory devices, Such as DDR-II , SDRAM , SGRAM , RAMBUS and next-generation memory products.

Bonding Wire ( Sumitomo Metal Mining )
Contact Window : Steven
We have bonding wire in wide range of diameters suitable for high/low loop and ultra fine pitch processes. We supply bonding wire to all major IC packaging and discrete component factories.  

Lead-free Solder Ball  ( HITACHI )
Contact Window : SL
We supply a full range size of lead-free solder balls. And with our advanced R&D technology and production technology, we are able to provide you high quality and products.

UV Tape  ( Sumitomo Bakelite )
Contact Window : Steve
We supply high stability and workability UV tape pre-cut for IC wafer sawing.

Auto Molding Equipment / G-LINE ( APIC YAMADA )
Contact Window : Thomas
Our fully automated molding equipment is designed with the modular concept. Modules can be increased from two to four to meet customers' capacity needs. The key difference from componetiong products is that we have applied to patent our "FAME" technology in several nations. Now your can use "FAME" to satisfy your products needs.

Trim & Form Equipment / A-COMBO Series  ( APIC YAMADA )
Contact Window : Cyrano 
Targeting our customers' specific needs, this system can be readily linked with other equipment. For instance, it is highly compatible with marketing, testing, tube loading, or tray loading systems. Both single-row TSOPs and multi-row QFPs can be handled by the same machine.
The change over time is about  30 minutes. Capacity and efficiency have been sharply improved. Can be used with 20~80mm width leadframes.

Package Sawing Equipment / MAPS-300J  ( APIC YAMADA )
Contact Window : Alex
Plastic package dicing process is the one of epoch-making for the semiconductor assembly field. However, the high class wafer dicing system is only available in the market.
MAPS-300 series is developed for the dedicated plastic package singulation , which has in-line lay-out and high speed twin spindle.
This system provides low cost and easy in-line operation.

Lamp reflector of Backlight module  ( A-TEC JAPAN )
Contact Window : Dennis Chu 
We offer many types of high-reliability Lamp reflector of Backlight module ranging from 7” navigation monitor to 15.4 notebook. We offer Japanese high-relability mold technology with no scrap, no scratch and low defective rate to meet customers' specific needs.

High precision kiss-cutting machine UDP-3000  ( FUJISHOKO )
Contact Window : Dennis Chu
This is the super small die press machine with high precision feed, kiss-cutting available. The UDP-3000 has a 400W AC servo roll feeder as standard and 3 versions, which are 180SPM as standard and 300 SPM/400SPM. Tension guide prevents slanting and keeps proper alignment. NC roll feeder by AC servo is now standard with machine. All driving structure placed under the bed makes the machine stable and high precision. This machine does not require a big die space like C flame machine. This is especially good for increased stability.
This unique machine is the only one of its kind in the entire world. The UDP-3000 is safe to operate, durable, low vibration and high precision, which makes this the machine of choice.

High precision kiss-cutting machine UDP-5000 / 10T ( FUJISHOKO )
Contact Window : Dennis Chu
This is the small die press machine with high precision feed, kiss-cutting available. The UDP-5000/10T has a motorized slide adjustment and Die height counter as standard. Tension guide prevents slanting and keeps proper alignment. NC roll feeder is now AC servo motor. All driving structure placed under the bed makes themachine stable and high precision. This machine does not require a big die space like C flame machine. This is especially good for increased stability. This unique machine is the only one of its kind in the entire world. The UDP-5000/10T is safe to operate, durable, low vibration and high precision, which makes this the machine of hoice.

LM / KS Series  ( FUJISHOKO )
Contact Window : Dennis Chu
LM/KS Series laminators are ideal for multistrata laminating, multilayer laminating, application, and die-cutting that require high positioning precision (±0.2mm) for work that is 100 to 350mm wide. The machines can also be freely combined with various types of units to realize a custom lamination system capable of single, double or triple lamination waste peeling. (You can choose an aluminum or copper plate frame according to how much you want the machine to weigh.)