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Products & Service
IC Packing Material
EME
CRM
CRP
CRC
Cover Tape
L/F
BCC & QFN
FC-BGA-Substrate
Laminated Substrate
UV Tape
LaZ - low CTE core & PP material
IC Packing Device
Auto Molding Equipment / WCM-300L & GTM-X 120/170T
Trim & Form Equipment / A-COMBO Series
Package Sawing Equipment / MAPS-400J/400JB/400J+
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-920
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-930
TFT-LCD
Fine Pitch FPC
Green Industry
LED mold technology with liquid compound / Compression Mold
LED Lead Frame for Ejection Molding
EMC LED Lead Frame
EMC LED Lead Frame for Transfer Molding
Solar Power System
Solar Power System
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Products & Service
IC Packing Device
Auto Molding Equipment
Trim & Form Equipment
Package Sawing Equipment/MAPS-400J/400JB/400J+
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-920
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-930
