About US

  • CWE Overview
  • President's Preface
  • History and Timeline
  • Organization
  • Leadership
  • Core Competencies
  • Awards
  • Partners
  • Affiliates

Products & Service

  • IC Packing Material
  • IC Packing Device
  • TFT-LCD
  • Green Industry
  • EMC LED Lead Frame
  • Solar Power System

Investor Relations

Financial Information

  • Financial Summary
  • Monthly Revenues
  • Quarterly Results
  • Annual Reports
  • Analyst Meeting

Shareholder Services

  • Stock Quotes
  • Dividend
  • Shareholders' Meeting
  • Market Observation Post Station
  • Investors Contact Information

Corporate Governance

Structure

  • Overview

Operations

  • Guard against Insider Trading
  • Corporate Governance Officer

Board of Directors

  • Biographies
  • Independent Directors’ Professional Qualifications and Independence
  • Diversity of Directors Members
  • Major Resolutions of Board Meetings
  • Board of Director's Self-Assessment of Performance

Committee

  • Board Committee Membership
  • Communications between the independent directors, CAE and independent auditors

Internal Audit

  • Internal Audit

Important Internal Regulations

  • Major Internal Policies

Intellectual Property Management Plan

  • Intellectual Property Management Plan and Implementation Status

Interested Party

  • Interested Party

Contact Us

  • Service Locations
  • Online Services
  • Investor Relations & Media Contact
CWE 長華電材股份有限公司 中文版
  • About Us
  • Products & Service
  • Investor Relations
  • Corporate Governance
  • Interested Party
  • Staff
  • Contact Us

Products & Service

  • IC Packing Material
    • EME
    • CRM
    • CRP
    • CRC
    • Cover Tape
    • L/F
    • BCC & QFN
    • FC-BGA-Substrate
    • Laminated Substrate
    • UV Tape
    • LaZ - low CTE core & PP material
  • IC Packing Device
    • Auto Molding Equipment / WCM-300L & GTM-X 120/170T
    • Trim & Form Equipment / A-COMBO Series
    • Package Sawing Equipment / MAPS-400J/400JB/400J+
    • Fluid Dispensing Systems / Spectrum™ II Series: Model S2-920
    • Fluid Dispensing Systems / Spectrum™ II Series: Model S2-930
  • TFT-LCD
    • Fine Pitch FPC
  • Green Industry
    • LED mold technology with liquid compound / Compression Mold
    • LED Lead Frame for Ejection Molding
  • EMC LED Lead Frame
    • EMC LED Lead Frame for Transfer Molding
  • Solar Power System
    • Solar Power System
  • You are here:  
  • Home
  • Products & Service
  • IC Packing Device

Auto Molding Equipment

Trim & Form Equipment

Package Sawing Equipment/MAPS-400J/400JB/400J+

Fluid Dispensing Systems / Spectrum™ II Series: Model S2-920

Fluid Dispensing Systems / Spectrum™ II Series: Model S2-930

Back to Top

© 2022 Chang Wah Electromaterials Inc. All Rights Reserved.