product
Product Name:LED mold technology with liquid compound / Compression Mold
Contact Window:Alex Chang
EMAIL:This email address is being protected from spambots. You need JavaScript enabled to view it.
Supplier:APIC YAMADA
product desc
The manual/Auto mold equipment is match the module design rule, the equipment also applies to LED packing territory.
1. Ability for Liquid Compound – Higher Power & Longer Life – Durability for Heat & Light
2. Lower Cost production – Higher Productivity – Lesser Process – Capability for Low Cost Interposer (Lead Frame)
3. Smaller & Thinner Package – Freedom of Package design – Simple package design/construction