product
Product Name: EME
Application Industry: IC Packaging
Contact Window: Kevin Chao
EMAIL:This email address is being protected from spambots. You need JavaScript enabled to view it.
Supplier: Sumitomo Bakelite

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Sumitomo Bakelite Molding Compound provides the outstanding performance and the good usability.

Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & laminated base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly request.

Under the high performance and the long-term reliability request, has succeeded proposed cost-down solution and the widespread use in each IC packaging factories, production have reached World Wide No.1.

Application:

Encapsulation
JEDEC