product
Product Name:FC-BGA Substrate
Application Industry:Telecommunications,Portable products
Contact Window:Ivan Chiang
EMAIL:This email address is being protected from spambots. You need JavaScript enabled to view it.
Supplier:Kyocera SLC Technologies
product desc
The BCC/QFN package types are suitable for small size/ light weight packages which requires excellent electrical and thermal dissipation performance. Sumitomo Metal Mining is the Taiwan’s largest and most Complete vendor.

Application:

Telecommunications (wireless application like cellular phone, handset, base station and wireless LAN, etc.),
Portable products (like PDA and digital camera)