Product & Service
IC/LED packaging equipment
Auto Molding Equipment / WCM-300L/330
WCM-300L/330 (FOWLP/FIWLP/EWLP compatible, high precision, high quality, fully automatic molding system) - High precision platen parallelism by adopting 4-axis linear motion motor. - Equipped with a high-pressure 85-ton press that enables MUF molding technology. - Both liquid and granular resin can be supplied. - Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc. - SEMI S2 compliant, SEMI S8/CE optional - FOWLP: Fan-Out Wafer Level Package - FIWLP: Fan-In Wafer Level Package - EWLP: Embedded Wafer Level package Package - Wide range of target sizes: 8-inch wafers, 12-inch wafers, SUS carrier φ350mm. - Equipped with upper and lower FAMEs to achieve high-quality full mold molding. - Independent control of 4-axis servo motors enables platen tilt adjustment by changing motor parameters. - Pursuit of WLP molding quality by 8-stage resin flow control Stable high-speed transfer even for warped wafers. - Measures against electrostatic discharge (ESD) are taken at the wafer contact area.
Auto Molding Equipment / GTM-X 120/170T
GTM-X 120/170T (Transfer Molding system for large scale ECU) - Transfer molding system for efficient mass production of power semiconductors and large electronic devices. - Large-plate, high-output presses required for encapsulation of large devices. - Dual in-line plunger layout supports large package products. - Individual preheat stages ensure stable molding quality. - Large-capacity twin hopper for supplying mini tablets to large-sized packages. - Support for multiple mini tablets and high-cycle alignment to meet product tact time. - The number of presses can be selected according to the production volume by the module connection system.
Trim & Form Equipment / A-COMBO Series
Higher matrix and larger frame size for more productivity isbeing continued to the next stage, where the ordinary T/Fsystem can not comply. COMBO-300SW is new-released to comply to this kind of needs. This system can handle 300mmL x 100mmW, 8-linematrix frame. COMBO-300DC, which has tool compatibility with old A-COMBO is also available. - Continuous molding cycle of 140 spm is achievable by synchronized press operation and unique material handling mechanism. - Each function is modularized to accommodate the multifunctional front and rear processes of semiconductor manufacturing. - The system can be easily reconfigured and added after delivery. - In the trim & forming area of the machine, a full-open function is provided for the press mechanism used to drive the machine, making it easy to perform mold maintenance.
Auto Molding Equipment / LPM-600
LPM-600 (Realization of automatic molding of ultra-large panels of up to 620mm*620mm) - High precision TTV is realized by our original 4-axis linear motion structure press. - The TTV can be adjusted in micron units in a short time (minimum setting value: 1μm). - Both granule and liquid resin can be handled, making it possible to use for various process development. - The combination of the unique dynamic panel clamping technology and preheat function can be used for large warped products and brittle material panels. - Excellent panel positioning accuracy is achieved with the image processing alignment function. - The panel back side cleaning function is equipped as standard to prevent cracks and dents during molding. - The face-up (upper mold cavity) molding method enables molding of heavy and warped panels without the risk of product drop even under high vacuum molding. - Process monitoring and control functions maintain stable quality.
GTM/GTM-X full auto mold equipment for LED production
The manual/Auto mold equipment matches the module design rule and also applies to LED packing territory. 1. Ability for Liquid Compound: Higher Power & Longer Life. Durability for Heat & Light. 2. Lower Cost production: Higher Productivity. Lesser Process. Capability for Low Cost Interposer (Lead Frame). 3. Smaller & Thinner Package: Freedom of Package design. Simple package design/construction.
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-920
Scalable solutions for high-volume manufacturing and assembly . The scalable S2-920 is ideal for high-volume production of advanced dispensing processes, including underfill, cavity fill, die attach, and encapsulation.
Fluid Dispensing Systems / Spectrum™ II Series: Model S2-930
Scalable fluid dispense system for flux jetting and precise coating applications . Features and Benefits: 1. Selective flux jetting improves package reliability, production throughput and material utilization 2. Nordson ASYMTEK’s DJ-2200 DispenseJet® valve with coaxial air technology enables thin flux coatings as low as 5 μm 3. Selective flux jetting provides excellent edge definition (0.5 to 1 mm), minimizes flux residue and reduces or eliminates cleaning The model S2-930 inline dispensing system provides exceptional accuracy and reliability for selectrively jetting low-viscosity flux (and some high-tack fluxes) and other precise coating materials.