Product & Service
IC/LED packaging equipment
GTM/GTM-X full auto mold equipment for LED production
- Supplier： APIC YAMADA
- Contact Window： Alex Chang / alex@cwei.com.tw
Description
Application
Description
The manual/Auto mold equipment matches the module design rule and also applies to LED packing territory.
1. Ability for Liquid Compound: Higher Power & Longer Life. Durability for Heat & Light.
2. Lower Cost production: Higher Productivity. Lesser Process. Capability for Low Cost Interposer (Lead Frame).
3. Smaller & Thinner Package: Freedom of Package design. Simple package design/construction.
Application
Application：Automotive、Opto-Electronic、Energy
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Automotive -
Opto-Electronic -
Energy
