Product & Service

EME

CWE is selling WW #1 market share, Sumitomo Bakelite Molding Compound(EME) provides the outstanding performance and the good usability. Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & plastic substrate base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly requests and competitable to the industry standard Lead-Free requirements. Compllete product lineups cover Lead Fram、plastic substrate 、Wafer-Level and Fan-Out types of IC packages. Application : Encapsulation.

Percentage of revenue: 30%

Lead Frame

The world class vendor. SMMAP manufactures all types of metal lead frames with full range of pin count and matrix design. We specializes in metal as well as tape packages. We are also developing super matrix , fine-pitch, and deeper downset lead frames.

Percentage of revenue: 29%

Laminated Substrate

ASE Electronics has among the industry's most advanced Laminated Substrate process capability to provide single / double / 4 layer and 6 layers of the IC carrier to comply with electronic / computer peripherals, consumer electronics, wireless communications and networking equipment and other products needs. Product categories include: BOC Substrate Memory Card Substrate CSP Substrate SiP / POP Substrate PBGA Substrate

Percentage of revenue: 15%

CRM

CWE is selling Sumitomo Bakelite conductive & non-conductive Die Attach Paste provide excellent feature & good workability.

FCCSP / FCBGA Substrate

FC-BGA substrates are semiconductor packages with fine design rule and high reliability. KYOCERA provides IC packages with more than 3000 I/Os,up to 6-n-6 layers and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology. Application: 1. ASICs for servers / routers 2. MPUs for high performance game consoles 3. Graphics processors, etc.

Release Film

CWE is selling ASAHI GLASS release film for semiconductor molding procress application. - Build-up / HDI , BGA, CSP and WLP products AGC filem raw material is the proper flexibility of Tifluoron at high temperature to absorb the unevenness of the copper and separator plate like cushion, so that the resin can completely cover the material without any air gap. If a stiff film is used, it causes a space or a gap near the edge of the copper laminate. AGC film has excellent tensile strength, and tensile elongation at high temperature, it can stop resin overflowing and without any burr or flow-mark.

Cover Tape

CWE is selling Sumitomo Bakelite Cover Tape meet to insdustry's green requirement(RoHS/SONY GP), used for semiconductor IC & Discrete and Passive Components product packing/protection with ESD production feature, and also meet requirements of end-ccustomer high speed SMT process. Application : 1. Chip carrier. 2. Semiconductor Package packing & protection.

UV Tape

CWE is selling Sumitomo Bakelite UV Tape with General and Anti-ESD types. Apply for Semiconductor & Electronics component saw & carry purpose. Featuring with good process-ability 、dicing performance and also can be uses for IC Chip & Components carrier ,capable to cover most IC chip types. Application: 1.Wafer sawing 2.Package sawing 3. Chip & Component carrier

LaZ - low CTE core & PP material

Sumitomo Bakelite low CTE material, including core and prepreg, are used to produce low warpage IC substrate. The developing trends and characteristics of electrical products are thin and light. Sumitomo low CTE materials are capable to provide the best solution for IC substrate, in terms of warpage and reliability testing performance. Now, worldwide IC design houses are starting to use Sumitomo low CTE materials for IC substrate mass production. Application: Plastic Substrate、Ultra-thin passsitive component substrate、Flexural Circuit Board.

Dummy & Monitor Wafer

Product:12"Silicon Wafer Reclaim Service/12" Monitor wafer/12" Dummy wafer /12" Test wafer. We supply high quality reclaim wafers processed by the most advanced equipments and high level polishing and cleaning technology. We also supply 12" monitor / 12" dummy & 12" Test wafers that meet customer's need.