Product & Service

EME

CWE is selling WW #1 market share, Sumitomo Bakelite Molding Compound(EME) provides the outstanding performance and the good usability. Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & plastic substrate base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly requests and competitable to the industry standard Lead-Free requirements. Compllete product lineups cover Lead Fram、plastic substrate 、Wafer-Level and Fan-Out types of IC packages. Application : Encapsulation.

Percentage of revenue: 30%

Light Guide Plate

CHIMEI’s ACRYSTEX® Optical MS Sheets are optical plates manufactured with CHIMEI-produced optical grade styrene methyl methacrylate (SMMA). These sheets feature good weather resistance, high heat resistance, high transparency and gloss, as well as stable physical, chemical, optical, and electrical properties. To drive the creation of ultra-narrow border and ultra-thin screens, ACRYSTEX® Optical MS Sheets offer low water absorption, meaning they maintain high dimensional stability. They are widely used in backlight and optical grade light guide plates, scanners, cover films, lighting signage, and backlight modules. This material is UL certified.

Fine Pitch FPC

FPC allows three-dimension assembly, and it can fit variety outer case sizing. FPC has high flexibility and dynamic moving capability. FPC makes devices smaller, thinner, shorter and lighter. FPC could fit high routing density demand. Application: Benefit for assembly, reliability and connection.

Lead Frame

The world class vendor. SMMAP manufactures all types of metal lead frames with full range of pin count and matrix design. We specializes in metal as well as tape packages. We are also developing super matrix , fine-pitch, and deeper downset lead frames.

Percentage of revenue: 29%

Laminated Substrate

ASE Electronics has among the industry's most advanced Laminated Substrate process capability to provide single / double / 4 layer and 6 layers of the IC carrier to comply with electronic / computer peripherals, consumer electronics, wireless communications and networking equipment and other products needs. Product categories include: BOC Substrate Memory Card Substrate CSP Substrate SiP / POP Substrate PBGA Substrate

Percentage of revenue: 15%

CRM

CWE is selling Sumitomo Bakelite conductive & non-conductive Die Attach Paste provide excellent feature & good workability.

FCCSP / FCBGA Substrate

FC-BGA substrates are semiconductor packages with fine design rule and high reliability. KYOCERA provides IC packages with more than 3000 I/Os,up to 6-n-6 layers and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology. Application: 1. ASICs for servers / routers 2. MPUs for high performance game consoles 3. Graphics processors, etc.

Release Film

CWE is selling ASAHI GLASS release film for semiconductor molding procress application. - Build-up / HDI , BGA, CSP and WLP products AGC filem raw material is the proper flexibility of Tifluoron at high temperature to absorb the unevenness of the copper and separator plate like cushion, so that the resin can completely cover the material without any air gap. If a stiff film is used, it causes a space or a gap near the edge of the copper laminate. AGC film has excellent tensile strength, and tensile elongation at high temperature, it can stop resin overflowing and without any burr or flow-mark.

Cover Tape

CWE is selling Sumitomo Bakelite Cover Tape meet to insdustry's green requirement(RoHS/SONY GP), used for semiconductor IC & Discrete and Passive Components product packing/protection with ESD production feature, and also meet requirements of end-ccustomer high speed SMT process. Application : 1. Chip carrier. 2. Semiconductor Package packing & protection.

UV Tape

CWE is selling Sumitomo Bakelite UV Tape with General and Anti-ESD types. Apply for Semiconductor & Electronics component saw & carry purpose. Featuring with good process-ability 、dicing performance and also can be uses for IC Chip & Components carrier ,capable to cover most IC chip types. Application: 1.Wafer sawing 2.Package sawing 3. Chip & Component carrier