Product & Service

EME

CWE is selling WW #1 market share, Sumitomo Bakelite Molding Compound(EME) provides the outstanding performance and the good usability. Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & plastic substrate base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly requests and competitable to the industry standard Lead-Free requirements. Compllete product lineups cover Lead Fram、plastic substrate 、Wafer-Level and Fan-Out types of IC packages. Application : Encapsulation.

Percentage of revenue: 30%

CRM

CWE is selling Sumitomo Bakelite conductive & non-conductive Die Attach Paste provide excellent feature & good workability.

Cover Tape

CWE is selling Sumitomo Bakelite Cover Tape meet to insdustry's green requirement(RoHS/SONY GP), used for semiconductor IC & Discrete and Passive Components product packing/protection with ESD production feature, and also meet requirements of end-ccustomer high speed SMT process. Application : 1. Chip carrier. 2. Semiconductor Package packing & protection.

UV Tape

CWE is selling Sumitomo Bakelite UV Tape with General and Anti-ESD types. Apply for Semiconductor & Electronics component saw & carry purpose. Featuring with good process-ability 、dicing performance and also can be uses for IC Chip & Components carrier ,capable to cover most IC chip types. Application: 1.Wafer sawing 2.Package sawing 3. Chip & Component carrier

LaZ - low CTE core & PP material

Sumitomo Bakelite low CTE material, including core and prepreg, are used to produce low warpage IC substrate. The developing trends and characteristics of electrical products are thin and light. Sumitomo low CTE materials are capable to provide the best solution for IC substrate, in terms of warpage and reliability testing performance. Now, worldwide IC design houses are starting to use Sumitomo low CTE materials for IC substrate mass production. Application: Plastic Substrate、Ultra-thin passsitive component substrate、Flexural Circuit Board.