Product & Service
EMC LED lead frames
Mini LED & IC BT-like Substrate
We provide BT-like substrate with fine pattern, high density and thinner thickness by introducing Sumitomo Bakelite LaZ Roll type CCL and manufacturing by Mektec & JMC's Roll to Roll process.
LED Lead Frame / Mini LED Lead Frame
CWE will provide integrated solution for manufacture. We have our own design, tooling developed, etching technology, plating technology and transfer molding technology( Epoxy) of LED Packing. It will become encapsulation material for die bonding, wire bonding, dispenser, making indispensable in the LED Packing factory. EMC: Epoxy Molding Compound EMC LED lead frame, what we call usually "Pre-Mold LED lead frame", will be applied to high-power LED package with a lead frame to provide a combination of copper and high-performance thermosetting plastics for SMD applications. The appreciation of thermosetting plastic has two applications, Epoxy and Silicon. The former will be the mainstream. CWTC develops EMC LED lead frame and it will become the mainstream in Epoxy lead frame and Mini LED lead frame field, which can be applied on displays and backlight products. The advantage of EMC LED lead frame is that we choose high-precision and high-productivity Etching Copper material, and we use Auto Molding system with high precision Molding Mold Chase for this highly integrated MAP Type LED package. It will have high density, high heat resistance, anti-yellowing, and high air pressurization to pass Red Ink Testing.