Product & Service

EME

CWE is selling WW #1 market share, Sumitomo Bakelite Molding Compound(EME) provides the outstanding performance and the good usability. Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & plastic substrate base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly requests and competitable to the industry standard Lead-Free requirements. Compllete product lineups cover Lead Fram、plastic substrate 、Wafer-Level and Fan-Out types of IC packages. Application : Encapsulation.

Percentage of revenue: 30%

Lead Frame

The world class vendor. SMMAP manufactures all types of metal lead frames with full range of pin count and matrix design. We specializes in metal as well as tape packages. We are also developing super matrix , fine-pitch, and deeper downset lead frames.

Percentage of revenue: 29%

CRM

CWE is selling Sumitomo Bakelite conductive & non-conductive Die Attach Paste provide excellent feature & good workability.

Release Film

CWE is selling ASAHI GLASS release film for semiconductor molding procress application. - Build-up / HDI , BGA, CSP and WLP products AGC filem raw material is the proper flexibility of Tifluoron at high temperature to absorb the unevenness of the copper and separator plate like cushion, so that the resin can completely cover the material without any air gap. If a stiff film is used, it causes a space or a gap near the edge of the copper laminate. AGC film has excellent tensile strength, and tensile elongation at high temperature, it can stop resin overflowing and without any burr or flow-mark.

Cover Tape

CWE is selling Sumitomo Bakelite Cover Tape meet to insdustry's green requirement(RoHS/SONY GP), used for semiconductor IC & Discrete and Passive Components product packing/protection with ESD production feature, and also meet requirements of end-ccustomer high speed SMT process. Application : 1. Chip carrier. 2. Semiconductor Package packing & protection.

UV Tape

CWE is selling Sumitomo Bakelite UV Tape with General and Anti-ESD types. Apply for Semiconductor & Electronics component saw & carry purpose. Featuring with good process-ability 、dicing performance and also can be uses for IC Chip & Components carrier ,capable to cover most IC chip types. Application: 1.Wafer sawing 2.Package sawing 3. Chip & Component carrier

LaZ - low CTE core & PP material

Sumitomo Bakelite low CTE material, including core and prepreg, are used to produce low warpage IC substrate. The developing trends and characteristics of electrical products are thin and light. Sumitomo low CTE materials are capable to provide the best solution for IC substrate, in terms of warpage and reliability testing performance. Now, worldwide IC design houses are starting to use Sumitomo low CTE materials for IC substrate mass production. Application: Plastic Substrate、Ultra-thin passsitive component substrate、Flexural Circuit Board.

Mini LED & IC BT-like Substrate

We provide BT-like substrate with fine pattern, high density and thinner thickness by introducing Sumitomo Bakelite LaZ Roll type CCL and manufacturing by Mektec & JMC's Roll to Roll process.

Auto Molding Equipment / WCM-300L/330

WCM-300L/330 (FOWLP/FIWLP/EWLP compatible, high precision, high quality, fully automatic molding system) - High precision platen parallelism by adopting 4-axis linear motion motor. - Equipped with a high-pressure 85-ton press that enables MUF molding technology. - Both liquid and granular resin can be supplied. - Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc. - SEMI S2 compliant, SEMI S8/CE optional - FOWLP: Fan-Out Wafer Level Package - FIWLP: Fan-In Wafer Level Package - EWLP: Embedded Wafer Level package Package - Wide range of target sizes: 8-inch wafers, 12-inch wafers, SUS carrier φ350mm. - Equipped with upper and lower FAMEs to achieve high-quality full mold molding. - Independent control of 4-axis servo motors enables platen tilt adjustment by changing motor parameters. - Pursuit of WLP molding quality by 8-stage resin flow control Stable high-speed transfer even for warped wafers. - Measures against electrostatic discharge (ESD) are taken at the wafer contact area.

Auto Molding Equipment / GTM-X 120/170T

GTM-X 120/170T (Transfer Molding system for large scale ECU) - Transfer molding system for efficient mass production of power semiconductors and large electronic devices. - Large-plate, high-output presses required for encapsulation of large devices. - Dual in-line plunger layout supports large package products. - Individual preheat stages ensure stable molding quality. - Large-capacity twin hopper for supplying mini tablets to large-sized packages. - Support for multiple mini tablets and high-cycle alignment to meet product tact time. - The number of presses can be selected according to the production volume by the module connection system.