FC-BGA substrates are semiconductor packages with fine design rule and high reliability. KYOCERA provides IC packages with more than 3000 I/Os,up to 6-n-6 layers and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology. Application: 1. ASICs for servers / routers 2. MPUs for high performance game consoles 3. Graphics processors, etc.
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