Product & Service
JMC
Fine Pitch FPC
FPC allows three-dimension assembly, and it can fit variety outer case sizing. FPC has high flexibility and dynamic moving capability. FPC makes devices smaller, thinner, shorter and lighter. FPC could fit high routing density demand. Application: Benefit for assembly, reliability and connection.
Mini LED & IC BT-like Substrate
We provide BT-like substrate with fine pattern, high density and thinner thickness by introducing Sumitomo Bakelite LaZ Roll type CCL and manufacturing by Mektec & JMC's Roll to Roll process.