CWE is selling ASAHI GLASS release film for semiconductor molding procress application. - Build-up / HDI , BGA, CSP and WLP products AGC filem raw material is the proper flexibility of Tifluoron at high temperature to absorb the unevenness of the copper and separator plate like cushion, so that the resin can completely cover the material without any air gap. If a stiff film is used, it causes a space or a gap near the edge of the copper laminate. AGC film has excellent tensile strength, and tensile elongation at high temperature, it can stop resin overflowing and without any burr or flow-mark.
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