Product & Service
IC Packaging Materials
EME
- Supplier： Sumitomo Bakelite
- Contact Window： Kevin Chao / kevin@cwei.com.tw
Description
Application
Description
CWE is selling WW #1 market share, Sumitomo Bakelite Molding Compound(EME) provides the outstanding performance and the good usability.
Superior moisture resistance & stress performance meets the high requirement for encapsulation of devices both leadframe base & plastic substrate base IC packages, and the formula does not including the banned substance, satisfies RoHS / SONY GP...etc. environment-friendly requests and competitable to the industry standard Lead-Free requirements.
Compllete product lineups cover Lead Fram、plastic substrate 、Wafer-Level and Fan-Out types of IC packages.
Application : Encapsulation.
Application
Application industry：PC Peripherals、Consumer Electronics、Network & Telecom、Mobile Devices、Automotive
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PC Peripherals -
Consumer Electronics -
Network & Telecom -
Mobile Devices -
Automotive