Product & Service

Description

GTM-X 120/170T (Transfer Molding system for large scale ECU)

- Transfer molding system for efficient mass production of power semiconductors and large electronic devices.

- Large-plate, high-output presses required for encapsulation of large devices.

- Dual in-line plunger layout supports large package products.

- Individual preheat stages ensure stable molding quality.

- Large-capacity twin hopper for supplying mini tablets to large-sized packages.

- Support for multiple mini tablets and high-cycle alignment to meet product tact time.

- The number of presses can be selected according to the production volume by the module connection system.