Product & Service

Description

Higher matrix and larger frame size for more productivity isbeing continued to the next stage, where the ordinary T/Fsystem can not comply.

COMBO-300SW is new-released to comply to this kind of needs. This system can handle 300mmL x 100mmW, 8-linematrix frame.

COMBO-300DC, which has tool compatibility with old A-COMBO is also available.                                                                                                         

- Continuous molding cycle of 140 spm is achievable by synchronized press operation and unique material handling mechanism.

- Each function is modularized to accommodate the multifunctional front and rear processes of semiconductor manufacturing.

- The system can be easily reconfigured and added after delivery.

- In the trim & forming area of the machine, a full-open function is provided for the press mechanism used to drive the machine, making it easy to perform mold maintenance.