Product & Service

Description

WCM-300L/330 (FOWLP/FIWLP/EWLP compatible, high precision, high quality, fully automatic molding system)

- High precision platen parallelism by adopting 4-axis linear motion motor.

- Equipped with a high-pressure 85-ton press that enables MUF molding technology.

- Both liquid and granular resin can be supplied.

- Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc.

- SEMI S2 compliant, SEMI S8/CE optional

- FOWLP: Fan-Out Wafer Level Package

- FIWLP: Fan-In Wafer Level Package

- EWLP: Embedded Wafer Level package Package                                                                                                        

- Wide range of target sizes: 8-inch wafers, 12-inch wafers, SUS carrier φ350mm.

- Equipped with upper and lower FAMEs to achieve high-quality full mold molding.

- Independent control of 4-axis servo motors enables platen tilt adjustment by changing motor parameters.

- Pursuit of WLP molding quality by 8-stage resin flow control

Stable high-speed transfer even for warped wafers.

- Measures against electrostatic discharge (ESD) are taken at the wafer contact area.