Product & Service
Mektec
Fine Pitch FPC
- Supplier： JMC、Mektec
- Contact Window： Ivan Chiang / ivan@cwei.com
Description
Application
Description
FPC allows three-dimension assembly, and it can fit variety outer case sizing.
FPC has high flexibility and dynamic moving capability.
FPC makes devices smaller, thinner, shorter and lighter.
FPC could fit high routing density demand.
Application:
Benefit for assembly, reliability and connection.
Application
Application：PC Peripherals、Consumer Electronics、Network & Telecom
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PC Peripherals -
Consumer Electronics -
Network & Telecom