Product & Service
IC Packaging Materials
FCCSP / FCBGA Substrate
- Supplier： Kyocera
- Contact Window： Ivan Chiang / ivan@cwei.com.tw
Description
Application
Description
FC-BGA substrates are semiconductor packages with fine design rule and high reliability.
KYOCERA provides IC packages with more than 3000 I/Os,up to 6-n-6 layers and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.
Application:
1. ASICs for servers / routers
2. MPUs for high performance game consoles
3. Graphics processors, etc.
Application
Application industry：PC Peripherals、Consumer Electronics、Network & Telecom
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PC Peripherals -
Consumer Electronics -
Network & Telecom