Product & Service
IC Packaging Materials
LaZ - low CTE core & PP material
- Supplier： Sumitomo Bakelite
- Contact Window： Max Lin / max.lin@cwei.com.tw
Description
Application
Description
Sumitomo Bakelite low CTE material, including core and prepreg, are used to produce low warpage IC substrate.
The developing trends and characteristics of electrical products are thin and light. Sumitomo low CTE materials are capable to provide the best solution for IC substrate, in terms of warpage and reliability testing performance. Now, worldwide IC design houses are starting to use Sumitomo low CTE materials for IC substrate mass production.
Application: Plastic Substrate、Ultra-thin passsitive component substrate、Flexural Circuit Board.
Application
Application industry：PC Peripherals、Consumer Electronics、Network & Telecom、Mobile Devices、Automotive
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PC Peripherals -
Consumer Electronics -
Network & Telecom -
Mobile Devices -
Automotive