Product & Service
IC Packaging Materials
Laminated Substrate
- Supplier： ASE Electronics
- Contact Window： Ivan Chiang / ivan@cwei.com.tw
Description
Application
Description
ASE Electronics has among the industry's most advanced Laminated Substrate process capability to provide single / double / 4 layer and 6 layers of the IC carrier to comply with electronic / computer peripherals, consumer electronics, wireless communications and networking equipment and other products needs.
Product categories include:
BOC Substrate
Memory Card Substrate
CSP Substrate
SiP / POP Substrate
PBGA Substrate
Application
Application industry：PC Peripherals、Consumer Electronics、Network & Telecom
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PC Peripherals -
Consumer Electronics -
Network & Telecom